JPH0624966Y2 - 巻線端末部の補強構造 - Google Patents
巻線端末部の補強構造Info
- Publication number
- JPH0624966Y2 JPH0624966Y2 JP1989104342U JP10434289U JPH0624966Y2 JP H0624966 Y2 JPH0624966 Y2 JP H0624966Y2 JP 1989104342 U JP1989104342 U JP 1989104342U JP 10434289 U JP10434289 U JP 10434289U JP H0624966 Y2 JPH0624966 Y2 JP H0624966Y2
- Authority
- JP
- Japan
- Prior art keywords
- bobbin
- winding
- terminal
- terminal pin
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004804 winding Methods 0.000 title claims description 29
- 230000002787 reinforcement Effects 0.000 title description 2
- 229920005989 resin Polymers 0.000 claims description 22
- 239000011347 resin Substances 0.000 claims description 22
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 230000003014 reinforcing effect Effects 0.000 claims description 5
- 229920003002 synthetic resin Polymers 0.000 claims description 4
- 239000000057 synthetic resin Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 6
- 230000002950 deficient Effects 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Coils Of Transformers For General Uses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989104342U JPH0624966Y2 (ja) | 1989-09-07 | 1989-09-07 | 巻線端末部の補強構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989104342U JPH0624966Y2 (ja) | 1989-09-07 | 1989-09-07 | 巻線端末部の補強構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0343709U JPH0343709U (en]) | 1991-04-24 |
| JPH0624966Y2 true JPH0624966Y2 (ja) | 1994-06-29 |
Family
ID=31653138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989104342U Expired - Lifetime JPH0624966Y2 (ja) | 1989-09-07 | 1989-09-07 | 巻線端末部の補強構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0624966Y2 (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5186767B2 (ja) * | 2007-01-11 | 2013-04-24 | 日本電産株式会社 | レゾルバおよびレゾルバの製造方法 |
| JP6345394B2 (ja) * | 2013-08-05 | 2018-06-20 | 株式会社不二工機 | 電磁コイル並びにそれを用いた電動弁及び電磁弁 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01154606U (en]) * | 1988-04-14 | 1989-10-24 |
-
1989
- 1989-09-07 JP JP1989104342U patent/JPH0624966Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0343709U (en]) | 1991-04-24 |
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